Arista Networks announced the formation of a multi-source agreement (MSA) for XPO, a revolutionary 12.8 Tbps liquid cooled optics module that supports a front panel density of 204.8 Tbps per open compute rack unit, a 4X improvement compared to 1600G-OSFP optics.
XPO was designed specifically to support AI networking including scale-up, scale-out, scale-across, and metro reach fabrics, offering the following key innovations:
- Record-Breaking Throughput: Delivers 12.8 Tbps per pluggable module.
- Unprecedented Rack Density: Achieves 204.8 Tbps per OCP rack unit.
- Integrated Cold Plate: Capable of cooling up to 400W power per module.
- Universality: Supports all industry optics standards (DR, FR, LR, SR, ZR/ZR+) as well as next-generation coherent-lite, slow&wide, copper, and RF-Microwave.
- Flexibility: Supports linear, half-retimed, or fully-retimed interface architectures.
«The unprecedented growth in AI fabric bandwidth and the transition to liquid cooling requires a new generation of pluggable optics modules,» said Andreas Bechtolsheim, Chief Architect at Arista Networks. «XPO solves this challenge by providing fundamental improvements in density, cooling capability and reliability for pluggable optics modules.»